检测・计量设备｜光学检测设备｜半导体封装Bump检测装置
RSH-120
经营本产品的公司名：Nidec Advance Technology Corporation
IC Substrate 2D/3D Bump Test System
Capable of implementing next generation IC Substrate 3D Bump inspection. Apply for Height & Vision inspection simultaneously (uBump, Round/Flattened, Warpage)
- 特点：
- Higher Throughput, Highest accuracy. Optimized Interface, Increased Usability. Implement Highest Throughput Dual Head Machine also available.
- 关于产品的咨询
- 相关垂询
关于产品的咨询
尼得科精密検測科技株式会社
邮件垂询
电话垂询
+81-75-280-8100
服务时间：9:00～17:30（周六日节假日除外）
