Semiconductor Package Inspection Systems

With the increasing integration of semiconductor devices, packages are becoming increasingly sophisticated. Nidec-Read inspection systems are advanced systems used for continuity (OPEN) tests, short circuit and insulation (SHORT) tests of semiconductor packages such as MCM, CSP, and BGA, and high-density build-up boards.

Semiconductor package inspection systems

Group Companies

Nidec-Read Corporation

Nidec-Read Corporation.

By providing high speed and highly precise inspections, Nidec-Read has earned the deep trust of customers worldwide by virtue of its main business in the field of energization inspections of printed circuit boards and semiconductor package boards.

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