Nidec-Read Corporation is pleased to announce that we will be attending SEMICON JAPAN 2022 from December 14th to the 16th at Tokyo Big Sight.
We are delighted to introduce our new product “IGBT/SiC module isolation/static/dynamic inspection”. We also look forward for the opportunity to provide you various cutting-edge test solutions such as “wafer electrical inspection,” “SV TCL probe cards” and “semiconductor wafer bump optical inspection system.”
We invite you to visit our booth and look forward to the opportunity to provide you with various test solutions for your unique needs.
Products on Exhibition
・ IGBT/SiC module isolation/static/dynamic inspection ”NATS-1000”
・ Multi-function tester ”R-700 series”
・ Automated Optical inspection system “Rwi series”
・ High precision jig “Φ15μm jig”
・ IC Package electrical inspection system “GATS series”
・ Probe cards (*displayed at the exhibition)