Inspection and measuring equipment｜Optical inspection equipment｜Substrate Bump Inspection System
RSH-120
companies handling the product：Nidec Advance Technology Corporation
IC Substrate 2D/3D Bump Test System
Capable of implementing next generation IC Substrate 3D Bump inspection. Apply for Height & Vision inspection simultaneously (uBump, Round/Flattened, Warpage)
- characteristics:
- Higher Throughput, Highest accuracy. Optimized Interface, Increased Usability. Implement Highest Throughput Dual Head Machine also available.
- Contact information for product inquiry
- Contact Us
Contact information for product inquiry
Nidec Advance Technology Corporation
inquiry by e-mail
inquiry by phone
+81-75-280-8100
business hours: 9:00 - 17:30 (Mon. - Fri. Weekdays only)
