OCP Global Summit 2026

The World's Premier Open Compute Event

The OCP Global Summit is the world's leading event for open IT infrastructure and hardware innovation, bringing together 10,000+ engineers, architects, and technology decision-makers from global hyperscalers, cloud providers, and data center operators.

Nidec will be exhibiting at Booth #E63, October 12–15 at the San Jose Convention Center. Don't miss your chance to see our latest thermal solutions. Contact us for more information.

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Value of Nidec Total DC Solution

Chillers, Piping, and CDUs – Fully Integrated

: Centralized Management

Simplified vendor coordination by unifying management into a single window, significantly reducing administrative and negotiation costs.

: High Reliability & Safety

Integrate total-system design with high-reliable components to prevent system-level mismatches and minimize leak and failure risks.

: Rapid Deployment

Delivers an End-to-End service from initial system design through installation to maintenance services, accelerating DC construction and operation.

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Featured at OCP 2026 — See It Live at Booth #E63

The Powerful Debut of Nidec’s In-Row Cooling Distribution Unit

In-Row CDU NIR3.0

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In-Row CDU

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In-Rack CDU

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Quick Disconnect & Manifold

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Stage Presentation

Join our session at OCP Global Summit 2026, where Nidec engineers will present our latest innovations in liquid cooling for AI-era data centers.

Book a Meeting

Meet Our Engineers at Booth #E63 Spots are limited.
Reserve your one-on-one meeting today.

Whether you're exploring a new liquid cooling architecture, evaluating CDU vendors, or looking for localized support — our engineers are ready to answer your questions in depth. Book your session in advance and make the most of your time at OCP 2026.