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Data Centre World Asia 2026

2026.09.07

Data Centre World Asia 2026

As the rapid expansion of AI and cloud technologies transforms digital infrastructure, Data Center World brings together industry leaders to showcase cutting edge solutions. From power and facility design to advanced thermal management, it is the premier platform shaping the future of next-generation data centers.

Empowering the AI Era with Nidec's Liquid Cooling Solutions

To solve the intense heat challenges of high-density AI clusters, Nidec presents scalable and high-efficiency liquid cooling innovations under the theme "Innovation Meets Efficiency : Designed for Scalability." Explore our comprehensive portfolio—including our latest In-Row and In-Rack CDUs, precision manifolds, and quick disconnects (QD)—engineered to maximize performance and sustainability.

Nidec Thermal Solutions

Value of Nidec Total DC Solution
Chillers, Piping, and CDUs – Fully Integrated

Centralized Management

Simplified vendor coordination by unifying management into a single window, significantly reducing administrative and negotiation costs.

High Reliability & Safety

Integrate total-system design with high-reliable components to prevent system-level mismatches and minimize leak and failure risks.

Rapid Deployment

Delivers an End-to-End service from initial system design through installation to maintenance services, accelerating DC construction and operation.

Exhibited Products

Visit Our Booth

[Event]
Data Centre World Singapore 2026 (TECH WEEK SINGAPORE)
[Dates]
September 29-30, 2026
[Location]
Marina Bay Sands, Sands Expo & Convention Centre
[Nidec Booth]
Level B2 / Booth #L45
Floor plan — Nidec Booth (Level B2 / Booth #L45)

Route to Nidec Booth

Located at Booth #L45 (Level B2), along the far right aisle right beside the Lifts to Level 1.

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