PCIM Asia Shenzhen 2026

Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) announced today that it will exhibit products at PCIM Asia Shenzhen 2026, an event scheduled to take place at Shenzhen World Exhibition & Convention Center from Wednesday, August 26 – Friday, August 28, 2026.

This upcoming exhibition is one of Asia’s largest international conventions dedicated to power electronics to feature power conversion, control, supply, and many other power electronics-related technologies and products. Nidec Advance Technology’s booth will showcase some of its cutting-edge inspection technologies and products related to IGBT/SiC and other next-generation power semiconductors. By exhibiting the following main products, the Company will offer part of its solutions to help improve product quality.

Nidec Advance Technology’s main exhibits will include:

■ NATS®-1000/1730 (IGBT/SiC power semiconductor module insulation, statis, and dynamic characteristics inspection system)
This inspection system is optimum for power semiconductor modules’ pre-shipment final inspection. At PCIM Asia Shenzhen 2026, the Company will showcase automatic inspection equipment capable of inspecting room-temperature insulation, high-temperature static characteristics, high-temperature dynamic characteristics, and room-temperature static characteristics in parallel, as well as manual inspection equipment widely used in R&D phases.

■ NATS®-2120 (PCB inspection system with built-in IGBT/SiC power semiconductors)
This inspection equipment is for printed substrates and modules mounted with high-power and -voltage power semiconductors. Capable of preventing false operations and thermal destruction that may occur under a high-load environment, this product secures high product quality even under severe conditions.