Company
NIDEC ADVANCE TECHNOLOGY CORPORATION
Representative
President & CEO, Hidekazu Yamazaki
Address
Nidec PARK Bldg.C,1-1 Higashinokuchi,Morimoto-cho, Muko-shi,Kyoto,617-0003,Japan
Inquiry
Chief of Corporate Management division, Kiyomu Yamaguchi
TEL
+81-75-280-8100

Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) today announced its participation in SEMICON Southeast Asia 2025, to be held from May 20 to May 22, 2025, at the Sands Expo and Convention Centre, Singapore.

At SEMICON SEA 2025, Nidec Advance Technology will present its latest portfolio of advanced inspection and testing solutions for the semiconductor industry. The Company’s featured exhibits will include state-of-the-art optical 2D/3D inspection equipment for semiconductor wafers (RWi300MK series), Conduction and short-circuit inspection equipment for semiconductor packages (GATS series), a large substrate electrical inspection system for AI servers (GATS-8360), AC/DC multi-tester (R-700 series), pin probe for ultra-high-precision inspections, and semiconductor wafer probe cards.

In addition to its core lineup of MEMS-Based, Vertical and Cantilever probe card products, Nidec Advance Technology will introduce new probing solutions specifically targeted for power semiconductors, a rapidly expanding segment of the IC market. Our new Chamber Head and Thermocoupling technologies are ideal test solutions for these power devices, crucial to the production of Electrical Vehicles (EV), cloud computing and renewable energy.

Visitors are invited to experience firsthand how the Company’s solutions can enhance quality and efficiency across the semiconductor value chain.

 

■Products on Exhibition

- Optical 2D/3D inspection equipment for semiconductor wafers (RWi300MK series)

- IGBT/SiC power module inspection equipment (NATS series)

- Conduction/short-circuit inspection equipment for semiconductor packages (GATS series)

- Large substrate electrical inspection system for AI servers (GATS-8360) 

- AC/DC multi-tester (R-700 series) 

- Pin probe for ultra-high-precision inspections

- Semiconductor wafer inspection probe card

 

PeriodTuesday, May 20 – Thursday, May 22, 2025
VenueSands Expo and Convention Centre Singapore
BoothLevel 1, Booth #L2421
Official website

https://www.semiconsea.org/