用于封装基板和PCB的光学自动外观检测设备
RSH-120
生产和销售公司：尼得科精密检测科技株式会社
IC Substrate 2D/3D Bump Test System
Capable of implementing next generation IC Substrate 3D Bump inspection. Apply for Height & Vision inspection simultaneously (uBump, Round/Flattened, Warpage)
characteristics: Higher Throughput, Highest accuracy. Optimized Interface, Increased Usability. Implement Highest Throughput Dual Head Machine also available.