用于封装基板和PCB的光学自动外观检测设备
RSH-230
生产和销售公司：尼得科精密检测科技株式会社
Warpage Inspection System for IC Substrate
Capable of performing FULL 2D and 3D bump inspection at the same time.
Features 1
High-Throughput & Accuracy. Warpage Inspection. Optimized user interface.