Inspection and measuring equipment|Optical inspection equipment|Wafer Bump Inspection System


companies handling the product:Nidec Advance Technology Corporation

Gold Bump Wafer Process 2D/3D Inspection System

Fully Integrated Simultaneous 2D/3D & High-Speed Scanning for Gold Bump Wafer

Simultaneous 3D and 2D Defect Inspection (including pitting, nodules, midget, etc.). Top Gold Bump Manufacturers Selected RWi-300G in 2017. Capable of All the Gold Bump Metrology Inspection Requirements.
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Nidec Advance Technology Corporation

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business hours: 9:00 - 17:30 (Mon. - Fri. Weekdays only)



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