Inspection and measuring equipment|Optical inspection equipment|Substrate Bump Inspection System


companies handling the product:Nidec Advance Technology Corporation

IC Substrate 2D/3D Bump Test System

Capable of implementing next generation IC Substrate 3D Bump inspection. Apply for Height & Vision inspection simultaneously (uBump, Round/Flattened, Warpage)

Higher Throughput, Highest accuracy. Optimized Interface, Increased Usability. Implement Highest Throughput Dual Head Machine also available.
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Nidec Advance Technology Corporation

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business hours: 9:00 - 17:30 (Mon. - Fri. Weekdays only)



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