Inspection and measuring equipment|Optical inspection equipment|Substrate Bump Inspection System

RSH-230

companies handling the product:Nidec Advance Technology Corporation

Warpage Inspection System for IC Substrate

Capable of performing FULL 2D and 3D bump inspection at the same time.

characteristics:
High-Throughput & Accuracy. Warpage Inspection. Optimized user interface.
Contact information for product inquiry
Contact Us

Contact information for product inquiry

Nidec Advance Technology Corporation

inquiry by e-mail

inquiry by phone

+81-75-280-8100

business hours: 9:00 - 17:30 (Mon. - Fri. Weekdays only)

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