Inspection and measuring equipment｜Optical inspection equipment｜Substrate Bump Inspection System
companies handling the product：Nidec Advance Technology Corporation
Warpage Inspection System for IC Substrate
Capable of performing FULL 2D and 3D bump inspection at the same time.
- High-Throughput & Accuracy. Warpage Inspection. Optimized user interface.
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Contact information for product inquiry
Nidec Advance Technology Corporation
inquiry by e-mail
inquiry by phone
business hours: 9:00 - 17:30 (Mon. - Fri. Weekdays only)