Core Technology of NIDEC-READ
Responding to increasingly multi-pin, fine pitch semiconductor packages and printed circuit boards, NIDEC-READ brings to the market breakthrough measuring/testing solutions that spot and analyze previously undetectable types of continuity errors.
Through a sophisticated fusion of multiple mechatronics elements, NIDEC-READ has extended inspection possibilities into mass production processes, including: high-precision positioning; high-speed feeding; safe and compact machinery design, and in-line process engineering.
High-precision jigs allow a testing device to ensure pinpoint accuracy in making contact with a number of test points on an intricately printed circuit board. NIDEC-READ offers broad-ranging expertise in CAD/CAM, probing, and precision machining, which is tailored to ultra fine-pitch component applications.
MEMS Process Technology
As semiconductor manufacturing process becomes increasingly geared toward finer nanostrucure design, the need for innovative inspection methods has never been greater. By leveraging its MEMS-oriented, three-dimensional process technology in areas ranging from electroforming to exposure, image development, and fine pattern etching, NIDEC-READ opens a new horizon for precision inspection.
Vision Inspection Technology
Non-contact imaging can spot various defect types that are undetectable by electrical means. NIDEC-READ’s technical portfolio in optical measurement, light source optimization, and associated algorithm design enables high-speed, high-resolution detection of very subtle defects that slip through human vision screening.