Inspection and measuring equipment｜Optical inspection equipment｜Substrate Bump Inspection System
RSH-230
companies handling the product：Nidec Advance Technology Corporation
Warpage Inspection System for IC Substrate
Capable of performing FULL 2D and 3D bump inspection at the same time.
- characteristics:
- High-Throughput & Accuracy. Warpage Inspection. Optimized user interface.
- Contact information for product inquiry
- Contact Us
Contact information for product inquiry
Nidec Advance Technology Corporation
inquiry by e-mail
inquiry by phone
+81-75-280-8100
business hours: 9:00 - 17:30 (Mon. - Fri. Weekdays only)
