Robots

Introduce of special robots of NIDEC INSTRUMENTS.
NIDEC INSTRUMENTS provides semiconductor wafer transfer robots and LCD/OLED glass transfer robots all over the world. We are developing our own motor that is the driving source of these robots.
The semiconductor wafer transfer robot developed by us realizes ultra-low vibration, high speed, space saving, and high efficiency transfer. We also respond to customer-specific customization requests. For example, we have many achievements in handling vacuum, high temperature, and chemical resistance.

The glass transport robot is recognized as a core technology such as ultra-low vibration control technology built up by NIDEC INSTRUMENTS, and currently has a global market share of 80% and has established itself as the de facto standard. Despite being a glass plate that exceeds a maximum of 3 m square, the thickness is 1 mm or less. When you lift and carry this glass plate with a fork, the glass plate bends greatly. If the robot vibrates during transportation, the glass plate will shake further and break. NIDEC INSTRUMENTS has completely suppressed the vibration of the transfer robot, and provides our customers with highly efficient production.

NIDEC INSTRUMENTS is launching a new robot project. It is a PLP glass transport robot. The FO-PLP glass transfer robot is a fusion of two cutting-edge technologies: a semiconductor wafer transfer robot and a glass transfer robot. As a result, we have succeeded in developing a dedicated embedded transfer robot that is optimal for the FO-PLP process.

FO-PLP manufacturing process

NIDEC INSTRUMENTS strongly supports the FO-PLP production that has revolutionized the semiconductor packaging process.
The FO-PLP production methods can be broadly classified into Mold first and RDL first. Mold first can be roughly divided into face-down and face-up. In each case, a large number of patterned semiconductor chips are arranged on a carrier and post-processes are executed. The most popular RDL first uses Glass for the carrier.
Between the processes, the Glass Carrie is stored in the FOUP dedicated to PLP and transported, and then transported to the Load Port dedicated to PLP. At Load Port, the FOUP door is opened and the glass transport robot inside EFEM takes out the Glass Carrier one by one and transports it to the process equipment.

Problems when transporting PLP glass carrier

A large number of semiconductor chips are mounted on the glass carrier. There are multiple process steps such as molding in the PLP process. A large amount of warpage occurs in the glass carrier due to the influence of process steps, but the characteristics of warpage differ depending on the process and the products installed. When putting the glass carrier in and out of the FOUP, there is a possibility of problems due to the warping of the glass carrier, such as interference with the glass forks other than the robot fork and interference between the glass carriers.

NIDEC INSTRUMENTS has the largest share in the world of liquid crystal/OLED glass transport robots. The problem of warpage, which has been a major obstacle in glass transportation, is solved by NIDEC INSTRUMENTS's unique vibration suppression control and high-speed transportation technology. NIDEC INSTRUMENTS will solve the problem of PLP's glass carrier transportation by using the core technology of glass transportation that has been created for many years, and support high quality and high throughput production.

FO-PLP related SEMI standards

Two PLP carrier sizes, 510 x 515 mm and 600 x 600 mm, will be established as SEMI standards.
Regarding PLP, we are developing several SEMI standards as follows:
・PLP Glass Carrier: Currently under development
・PLP Glass Carrier ID Marking: Currently under development
・PLP FOUP: Currently in development
・PLP Load Port: Currently under development

The established SEMI standard can be confirmed at the following URLs:
・Japanese URL: http://www1.semi.org/jp/node/61402
・English URL: https://www.semi.org/en/Standards/StandardsPublications

Technical Partners:
・PLP Glass carrier: Providing AGC Inc.
・PLP FOUP: Providing Shin-Etsu Polymer Co., Ltd.

Product Information Details

LCD/OLED glass transfer robot

View LCD/OLED Glass Transfer Robot Products

Semiconductor wafer transfer robot

View Semiconductor Wafer Robot Products

NIDEC INSTRUMENTS CORPORATION

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