AURCA Series

Full-color imaging provides a dramatic increase in information volume compared to monochrome images. This allows our AI detection algorithms to perform at their peak—identifying defects that were previously difficult for the human eye to detect, while minimizing the escape rate and suppressing false calls to the absolute limit.

Our AI analysis function evaluates the shape and root cause of detected defects. Going beyond simple defect identification, the system provides feedback on why a defect occurred, supporting the review of pre-processes and the formulation of recurrence prevention measures. By repeating this cycle, the system contributes significantly to increasing yield, reducing manufacturing costs, and improving overall quality.

The system detects a broad spectrum of defects, from trace flaws to via abnormalities and surface imperfections. It is compatible with a wide variety of substrates, including JEDEC-standard sizes, high-density package substrates, high-layer-count HDI boards, MSAP (Modified Semi-Additive Process) substrates, and PLP (Panel Level Packaging). We propose optimal system designs tailored to your specific production line configurations and precision requirements.