AOI System for Package Substrates & PCBs
RSH-120
Company：NIDEC ADVANCE TECHNOLOGY CORPORATION
IC Substrate 2D/3D Bump Test System
Capable of implementing next generation IC Substrate 3D Bump inspection. Apply for Height & Vision inspection simultaneously (uBump, Round/Flattened, Warpage)
characteristics: Higher Throughput, Highest accuracy. Optimized Interface, Increased Usability. Implement Highest Throughput Dual Head Machine also available.