AOI System for Semiconductor Wafers
AURCA-S Series
Company：NIDEC ADVANCE TECHNOLOGY CORPORATION
Features 1
Fusion of Full-Color Imaging and AI
Full-color imaging provides a dramatic increase in information volume compared to monochrome images. This allows our AI detection algorithms to perform at their peak—identifying defects that were previously difficult for the human eye to detect, while minimizing the escape rate and suppressing false calls to the absolute limit.
Features 2
Process Optimization through AI Technology
Our AI analysis function evaluates the shape and root cause of detected defects. Going beyond simple defect identification, the system provides feedback on why a defect occurred, supporting the review of pre-processes and the formulation of recurrence prevention measures. By repeating this cycle, the system contributes significantly to increasing yield, reducing manufacturing costs, and improving overall quality.
Features 3
Applications
Capable of detecting a wide range of defects across various applications, including: Logic ICs (AI, Automotive, etc.), Memory, LED, CIS (CMOS Image Sensors), MEMS, Probe Marks, Bumps, TSV, Edge Chipping, Adhesive residue, and more.