Laser・Semiconductore manufacturing equipment・Metal additive manufacturing|Laser processing system|Laser micro machining machines

Trial services for micro-machining and for room temperature wafer bonding

The handling companies : Nidec Machine Tool Corporation

Contact information for product inquiry
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We offer charged trial services for micro-machining and room temperature wafer bonding.
If your have some of following requests, please contact us.

  1. 1.To know if these process are applicable for your products
  2. 2.To use these machines as your research purpose
  3. 3.To compare other processes with these processes
  4. 4.To make a prototype using actual machines
  5. 5.To source some quantity of parts every month instead of installing machines

The machines for this service

Samples of the services

Room Temperature Wafer Bonding Machine BOND MEISTER

SiC/Si

Bonded wafers sample consisted of Sic and SI

Laser Micro Machining System ABLASER

Helical milling of heat resistant glasses

Helical milling of heat resistant glasses
Glass thickness : 0.8㎜

Helical milling of stainless1

Helical milling of stainless
Stainless thickness : 0.5㎜
Groove width :0.05mm

Helical milling of stainless2
Helical milling of stainless3

Contact us

Nidec Machine Tool Corporation

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