Semiconductor Package Inspection System
GATS®-7755
Company：NIDEC ADVANCE TECHNOLOGY CORPORATION
High speed shuttle, step and repeat style, Open/Leak automatic substrate inspection system
High speed & accuracy inspection for Fine Pitch FC-CSP, Next-generation’s inspection system available for core-less substrate! substrate pattern Open/Short inspection for Multi-pagination.
・Double-table shuttle style
・Comprehensive alignment accuracy ±2.5μm
・Available to embedded IC components test (Option)
・ High speed inspection with cable-less scanner
・Loading Standardized work holder
・Customize available from a diverse lineup of testers
・Best for core-less substrate