Semiconductor Package Inspection System
GATS®-7755 for ICS / SLP
Company：NIDEC ADVANCE TECHNOLOGY CORPORATION
High speed shuttle, step and repeat style, Open/Leak automatic substrate inspection system
High speed & accuracy inspection for Fine Pitch FC-CSP, Next-generation’s inspection system available for core-less substrate! substrate patternOpen/Short inspection for Multi-pagination.
Features 1
Double-table, shuttle style. Comprehensive alignment accuracy. Available to embedded IC components test (Option). High speed inspection with cable-less scanner. Loading Standardized work holder. Wider work, best for core-less substrate.