AOI System for Semiconductor Wafers
RWi-300
Company：NIDEC ADVANCE TECHNOLOGY CORPORATION
Gold Bump Wafer Process 2D/3D Inspection System
Fully Integrated Simultaneous 2D/3D & High-Speed Scanning for Gold Bump Wafer
Features 1
Simultaneous 3D and 2D Defect Inspection (including pitting, nodules, midget, etc.). Top Gold Bump Manufacturers Selected RWi-300G in 2017. Capable of All the Gold Bump Metrology Inspection Requirements.