Cool Things More Efficiently
In the wake of the age of IoT, AI, and 5G, the amount of data processed exploded, and it is expected to increase exponentially going forward. Accordingly, heat generation will pose a difficult problem as CPUs and GPUs become increasingly sophisticated. Heat is the last thing needed for electronic components. Insufficient measures would cause a so-called “thermal runaway,” then a possible glitch or a system shutdown. However, a simple solution ? such as cooling with a huge water-cooling system ? will not solve the problem. Using a large amount of electricity to cool a device will drive up costs, and run counter to the trend of decarbonization. Nidec seeks next-generation thermal solutions. While achieving high efficiency, low-level noise, and reliability, we hone our low-cost cooling technologies to continue to underpin the IT infrastructure.
Solutions to cool things more
Air-cooling fan that respond to thermal migration in a datacenterNidec’s high-air-capacity, high-static-pressure, and high-efficiency air-cooling fan that cool increasingly sophisticated servers
Coolant distribution units (CDU = water-cooling system) to respond to growing thermal loadsOffer CDUs and other heat-resisting solutions to meet requirements
Nidec’s technological capabilities to cool things more
Thermal solutionsNidec combines a variety of heat-resistance products to offer them as solutions
Types and features of Nidec’s fan motorsThis section explains the types and features of fan motors, the products that generate wind, transfer heat, and generate pressure.
Nidec's Technical Capabilities CAE Technology Developed In-HouseAt Nidec, we utilize original modeling technology and analysis software developed in-house to optimize the design of our fluid dynamic bearings.
Rapid PrototypingExceeding the Needs of our Customers with Shorter R&D Cycles and Reduced Costs
The Advanced CAE Technology behind our Optimally Designed Modules and UnitsCoupled analysis and other advanced CAE tools cut down on development times and make development of advanced modules and units easier.