Nidec Advance Technology Corporation

Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) today announced that it
will exhibit products at SEMICON China 2025, an event to be held at Shanghai New International Expo Centre from Wednesday, March 26 – Friday, March 28, 2025

 

 

This upcoming event – one of the largest of its kind to be held in China – will feature products from the semiconductor industry, including chip designing, manufacturing, packaging, measurement, equipment, and materials. More than 1,000 companies are expected to attend in 4,500-plus booths at this trade show.

Based on the theme, “Wafer Testing and Wafer Handling,” Nidec Advance Technology and Nidec Instruments Corporation (“Nidec Instruments”) will jointly display cutting-edge inspection- and product transfer-related solutions such as the Company’s optical visual inspection equipment and probe cards for the wafer-manufacturing process, and Nidec Instruments’ transfer robots.

In addition to the above products, Nidec Advance Technology will showcase its new technologies and products for power semiconductors, which are gaining a lot of attention these days. Please make sure to visit the Company’s booth at SEMICON China 2025.
 

About SEMICON China 2025
- Period: Wednesday, March 26 – Friday, March 28, 2025
- Venue: Shanghai New International Expo Centre
- Booth: E7861
- Official website: https://www.semiconchina.org/
 

Nidec Advance Technology’s main exhibits include:
- Optical 2D/3D inspection equipment for semiconductor wafers (RWi300MK series)
- IGBT/SiC power module inspection equipment (NATS series)
- Conduction/short-circuit inspection equipment for semiconductor packages (GATS series)
- Optical 2D/3D inspection equipment for high-density substrates (RSH series)
- Semiconductor wafer inspection probe card
- Semiconductor wafer transfer robot (SR8220, SR8241)
- FO-PLP transfer robot (SR9188)
- AC servo amps & motors (S-FLAG dynamic motion series)