Nidec Advance Technology Corporation

Nidec Advance Technology Corporation (“Nidec Advance Technology” or the “Company”) announced today that it will exhibit products at TPCA Show TAIPEI 2025, an international exhibition for electronic circuit manufacturers to be held at Taiwan Taipei Nangang Exhibition Center from Wednesday, October 22 – Friday, October 24, 2025.

This event, to be hosted by Taiwan Print Circuit Association (TPCA), will showcase all products and technologies related to the PCB (printed circuit board) industry, including: electronic circuits and mounting technology for electronics, information and communications; and raw materials and chemicals for electronic substrates. 

Under the theme, “Innovative, quality-supporting inspection technology in the age of AI,” Nidec Advance Technology will display solutions that are optimized to secure the quality of high-end circuit substrates becoming increasingly large and sophisticated based on miniaturization and heterogeneous integration, and that respond to the needs of the constantly evolving electronics industry.

In addition, the Company will demonstrate an AGV-based (automated guided vehiclebased) automatic transfer system to solve the growing labor shortage, and an EFEM system. Please come visit our booth to experience possibilities of inspection process automation and improved production efficiency.

On another note, Mr. Michio Kaida, Chairman of Nidec Advance Technology, has received the 2025 TPCA International Outstanding Contribution Award, hosted by TPCA, for his significant contribution to the development of Taiwan’s PCB industry. The award ceremony for Mr. Kaida will be held on October 22, 2025, when TPCA Show TAIPEI 2025 is being held. 

For more information on the award, please visit:
https://www.tpca.org.tw/Message/MessageView?id=27507. 

About TPCA Show TAIPEI 2025: 
- Period: Wednesday, October 22 – Friday, October 24, 2025
- Venue: Taiwan Taipei Nangang Exhibition Center (TaiNEX 1)
- Booth: M-1425
- Official website: https://www.tpcashow.com/en/

Nidec Advance Technology’s main exhibits will include:
- GATS788x (continuity/shunt inspection equipment for FOPLP/RDL)
- GATS2300/787x Series (advanced package-responsive continuity/shunt inspection equipment)
- STAR REC Series (OAM-responsive continuity/shunt inspection equipment for HDI/PCB)
- GATS8360 (large, CoWoP-responsive continuity/shunt inspection equipment for HDI)
- RSH-S80iAMPTV (IC substrate 2D/3D bump optical inspection equipment)
- High-precision 2D/3D inspection solutions for TGV
- CT-responsive X-ray inspection equipment
- AVI + AI optical inspection equipment for PCB
- EFEM Series (automatic transfer mechanism capable of handling the full panel size)

Machines to be displayed will include:
- STAR REC M1 + AGV transfer system
- Genmark’s transfer robot capable of handling the full panel size